Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. A window opening in the panel has an edge extending along a lower periphery of the window opening from a first side to a second side of the window opening. It is configured so that a change in the fluid pressure inside the chamber results in a change in non-rotational-symmetric imaging properties of the optical element having n-fold symmetry. Therefore, while achieving the downsizing of the apparatus, the containers to be used can be selected in accordance with the test items in such a manner that the fixed containers 21 are used as high-accuracy containers to be cleaned and reused and the disposable containers 22 are used as low-cost disposable containers.