A method for forming a solder bump structure with increased height. In particular, the methods of the invention comprise screening a library of test compounds, each of which is attached to a solid support, with a dye-labeled RNA molecule to form a dye-labeled target RNA:support-attached test compound complex. It is determined using the NBP whether an authentication request submitted by the user was successful. The porous material further has a length, a width and a thickness, the porous material defining at least a portion of one wall of a bulk flow path through which the at least one reactant passes. Operation means being provided to move the cutting and sealing blade from a rest position to a work position where the cutting and sealing blade engages said cutting and sealing counter blade.