A descriptive-profile mercantile method, for use at a juncture in a data-communications topology having associated therewith a maintained databank of partial profiles, is disclosed. The method, in one embodiment, includes inspecting a semiconductor wafer including a plurality of die for a defect, the inspecting providing an image of the semiconductor wafer including the defect. Usually, mapping matrices are used that, however, vary over frequency. These test circuits can be connected in a hierarchy or in parallel. The method comprises defining one or more non-overlapping sections of the pipeline corresponding to portions of the pipeline occupied by the data items of at least one data set. The first and second output nodes are configured to cooperatively establish a differential output signal based on the single-ended RF signal.