Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. A gate insulation film 22, a channel protection layer 24, and a passivation film 26 are each in the laminate configuration including a first layer 31 made of aluminum oxide, and a second layer 32 made of an insulation material including silicon. The fluoropolymer electrolyte has a monomer unit having an SO3Z group.