An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. Signal outputs of the modulated sources are optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. In hole injection transporting layer formed to extend along upper surface portions, upper surface portions in edge regions near banks are located higher than an upper surface portion in central region.