A single-event upset immune frequency divider circuit is disclosed. A window is formed within a backside substrate layer of the semiconductor. The computer implemented method further authenticates the subscriber identifier in the received request and sends the bootable system recovery image to the subscriber. The self-repair process occurs each time the DRAM integrated circuit is powered up, thus permitting the integrated circuit to adapt to failures when installed in electronic devices and lessening the need for repair during manufacturing. To the flow-out end surface, the airflow is guided from the flow-in end surface through the medium facing surface. The first to fifth transistors each have a voltage resistance level that is lower than power supply voltage.