In the case of an LOC semiconductor device, a semiconductor chip is fixed on a die pad through a die pad materiel. The first planar electrode at least partially surrounds the first upstanding electrode. If desired, the prosthesis replacement may also replace the natural pedicles. A channel quality of the currently active channel of each neighboring node is computed, and based on the computations, a transmission overhead is estimated for communicating with each neighboring node. Approaches address characteristic value layouts specifying fixed values and characteristic value layouts specifying non-fixed values. The method may also include calculating a score for the potentially matching record based on rank values and weight factors associated with the matching criteria.