By providing a tool internal sensor device in a process tool in a semiconductor facility, metal contamination may be monitored in situ, thereby avoiding or at least significantly reducing the requirement for sophisticated sample preparation techniques, such as vapor phase decomposition tests in combination with subsequent analysis procedures. A first heat exchanger and a second heat exchanger are disposed between the refrigerant circuit and the coolant circuit. In another aspect, one third of the FO function is deployed with appropriate feedback such that three successive cycles produce the FO output. After the pipelines are cleaned, a coating material is added into the pipelines and driven by the air flow in the substantially helical flow pattern to provide an even coating film on the cleaned inner surface of the pipelines.