A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. An electrical signal may be processed to determine a state change of a device. In some embodiments, all of the adhesives are substantially contact transparent. The thermal management system may further be in thermal contact with the heat dissipation element. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. A main pole consists of a pole tip having a part which provides the write track-width and a yoke part recessed from the air beating surface in the element height direction, and the pole tip consists of a pole tip at the trailing side where the width in the track-width direction is large and a pole tip at the leading side where the width in the track width direction is small.