A sensor mounting apparatus includes a base, a first installation arm, and a second installation arm. In the CMOS device, a buffer layer is disposed on a silicon substrate, and a first layer including a group III-V material is disposed on the buffer layer. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electronic devices using the above structure. A vacuum and an external clamp are provided, for facilitating engagement of the portion of the STFFM that is to be sutured. The system incorporates a hardware-accelerated packet processing module that handles in-sequence network packets and a software-based processing module that handles out-of-sequence and exception case network packets. The invention further relates to a record carrier for use in such a method and recording device.