A device comprises a substrate core having power paths through it and an inputoutput signal routing layer upon the core substrate. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. As a result, various mistakes and leakages due to manual operation may be reduced, and the terminal-lease service of the operator may be facilitated. The following expression is fulfilled: \u22120. The image sensor may perform a wide dynamic range function. The structural connector can be made with a bend that forms a first member adjacent the first flange and the embossment can extend through the bend into the first member.