The scales include a tray placed on a base and lifted by an air cushion, with no mechanical connection with the base. The heterogeneous integrated circuit includes a package substrate, a first die of a first technology, and a second die of a second technology, where the two dies are located in the same tier. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. The chock assembly 102L and bearing assembly 100 at the second end of the roll 12 is then positioned onto the opposite end of the roll 12, and a connecting sub-assembly 300, 400, 504A is secured to the second end of the axial center rod 22. Moreover, the portion of plane adjacent to the curved surface portion has a slope of between 12\xb0 and 8\xb0 in relation to the tangent plane. An improved method of manufacturing a surgical needle is further proposed.