A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The housing is formed with a first valve receiving hole in which the first damper valve is disposed, and a second valve receiving hole in which the second damper valve is disposed. A gate electrode makes contact with the titanium layer through an opening and P+-type diffusion layers make contact with the titanium layer through openings. The power stair may further include power features which will unfold or extend the additional stair sections. An individual entry in the queue is removed for performing the requested service via the spreadsheet computer program, thereby generating a result.