A sheet processing apparatus which is capable of improving the productivity of sheet processing as much as possible. The receptor moiety can bind either a specific analyte or a detectably labeled competitor moiety. The covering layers and the metallic layers can provide a buffering effect for effectively absorbing the thermal stress imposed on the conductive bumps to prevent delamination caused by the UBM layers. The housing has a first housing part with a housing wall running parallel to the circuit board and the punched grid plane.