A computer implemented process for data encryption or data decryption using a computer is disclosed. There are electrically conductive areas with a sensor element surface and an electrical contact face, as well as insulating areas. The first holding member has a thickness absorbing mechanism which biases the substrate toward the second holding member at positions along the substrate sealing line. Both the flange and a portion of the shank are divided by a plurality of axial slits. With the technique of the present invention, to remove a catalytic element used to crystallize a semiconductor film having an amorphous structure, gettering is completed by forming a region or a semiconductor film, to which a rare gas element is added, and by having the catalytic element move to the formed region or semiconductor film.