To aim at improvement of reliability of a semiconductor device of flip chip connection type. The electric heating plate is electrically connected to the cabinet, and is removable from the cabinet. A cross-section of the support member has a first surface profile of a first surface including a profile identical to a profile of each concave portion of the rear surface profile and a second surface of the support member is a flat surface. By using the start and end information, a modulator performs modulation depending on the data of each pixel in each string, providing a modulated signal. The compressed data is rearranged based on the repetitions of read order of the compressed data that are in a read order. The resin member contains a resin and 60 to 90% by weight of spherical filler.