A semiconductor workpiece processing tool comprises a plurality of process modules for processing the workpiece, where a number of the process modules include a robot loading window. Perimeter receiver fiber optics preferably are spaced apart from a source fiber optic and receive light from the surface of the objecttooth being measured. The nested arrangement allows the grouping of nested objects to be shrink-wrapped without use of trays or cardboard blanks if desired. Thereafter water is mixed into the sand and lime mixture at a weight ratio of from between 5 to 15 percent. The component can be configured in the shape of a slab but it can also have a more complex three-dimensional structure and can optionally be provided with mechanical functional elements. The apparatus comprises one or more sensors for sensing conditions at the component or articles and producing one or more signals and a wireless transmitter for wirelessly transmitting data based on the one or more signals to a remote device.