An imaging apparatus includes an image sensor, an AD conversion unit, a clamp processing unit, and a video signal correction unit. In some examples, an address in the non-volatile third dimension memory array provides an alias for another address in a disk drive. Also included in the chip stack are at least two integrated circuit chip packages. By predetermining a deposition thickness necessary to create the direct thermally conductive path, the deposition thickness can be controlled andor predicted. In order to develop the floor treatment system in such a way that improved electrical coupling of the connecting elements that are associated with one another is made possible, it is proposed according to the invention that at least one of the connecting elements that are associated with one another is mounted in a sprung manner. By virtue of the theoretical glenoid surface obtained by this method, it is possible to assist the surgeon in optimizing the position of implantation of a glenoid component and to produce a glenoid component \u201cmade to measure\u201d for the scapula that is to be fitted with a prosthesis.