A circuit arrangement includes at least two semiconductor chip having first and second load terminals that are each connected to one another, a first load current collecting conductor track, and also an external terminal electrically conductively connected thereto. The step of forming the substantially solid layer of material is preceded by the steps of\u2014providing a structure including recessed parts on a surface of a substantially solid further layer, and\u2014applying the intermediate composition so as at least partially to fill at least the recessed parts of the structure on the surface of the substantially solid further layer. The POD order is fulfilled in view of the custom color profile for the user. 09\xd7D, are disposed at a vertical pitch L1 in a range of 3\xd7D\u2266L1\u22664.