A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. Each connecting assembly comprises a well secured to a medial surface of each vertical tube of the support frame, and a hook that extends from each end of each shelf, with each hook having an opening extending therethrough. The joint comprises a pin to unlock the lock device and a connection fixed to the handle. The axial elements of the second stent interdigitate with the lateral elements of the first stent when both stents have been expanded. Signal paths 35, 35 to perform sending and receiving of electric signals between the apparatus body section and the functional sections are formed in the inside of the bracket or in a boundary portion between the front panel and the bracket. To provide a composition for a bulkhead which is used for molding a bulkhead constituting a discharge display cell of a thin display panel or mending a broken part thereof and which is improved in curability.