A semiconductor device is made by patterning a conductive layer for forming gates of transistors. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar to the heat sink by means of a hard solder layer and the heat sink to the supporting body by means of a further hard solder layer. The fastening tool further includes a feeder pawl assembly coupled to the magazine assembly. The power supply unit electrically connects with the first connection terminals for transmitting electric power. The method includes inducing vibrations in a glide head, detecting physical asperities on a disk surface, and communicating with a control module in response to the glide head coming in contact with at least one physical asperity.