An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The method involves the following steps: 1) Providing a paper furnish having a large amount of OCC in it, 2) adding strength promoter to the furnish prior to adding a strength agent to the furnish, 3) adding a strength agent to the furnish, and 4) making a paper product from the furnish. The digital compass is held placed on the gimbal mechanism. The ring member is connected to the light body behind the lens, and is locked to the headlight case at a position spaced away from an open edge thereof. The surface on the front side of the pointer instrument may be produced in one piece together with the housing part on the front side of the display device from plastic in a 2-component injection-molding process. The digital logic also reports the occurrence of said one or more tokens within said data stream without interrupting the data stream.