The invention eliminates the feeling of two-phase speed-change operations by causing a speed-change operation to proceed continuously when the speed-change operation is performed through two-phase control of engagement and release of four engagement elements. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching. In some embodiments, the system further includes an illumination scanner configured to scan a surface of the sample with at least a portion of apodized illumination. The first layer may be electroless copper and the second layer may be electrolytic copper.