The invention relates to a handle for actuating a device such as a video camera. The first and second contact parts are connected to the light emitting device to apply a first current to the light emitting device. The use solution is especially useful for cleaning floors in commercial kitchens of full service and quick service restaurants and is effective on a variety of floors, including quarry tile. The passivation layer enhances bond strength of a mold compound of the plastic package body to the metallized layer. The wafer level package may be used in microelectromechanical systems packaging at a vacuum level of about 10 mTorr or less such as close to 1 mTorr. The parting is effected while irradiating an entire area in which the imprint pattern of the mold is formed and the cured resin material with an electromagnetic wave for ionizing gaseous molecules in an atmosphere in which the mold and the cured resin material are placed.