A chemical mechanical polishing pad and a system and a method for using such a pad are described. An interface module receives a request to perform a business transaction from a caller application. In operation, the first clamping block and the second clamping block are forced to pivot in concert with each other, thereby facilitating the user operating the terminal pliers structure, and thereby saving the manual work. The blade server, the system management unit, and the multi-state recognition device all receive a main power source signal.