A semiconductor laser has a semiconductor body with first and second main areas, preferably each provided with a contact area, and also first and second mirror areas. The thickness of the insulating tape including the adhesive layer is set to a thin thickness, such as 0. The end region of the bore remote from the pressure-side surface of the concreted plate is drilled out and the one loop of the reinforcement element is pressed together and is led through the bore until this loop has reached the drilled-out hole and expands.