A copper metallization structure and its method of formation in which a layer of a copper alloy, such as CuMg or CuAl is deposited over a silicon oxide based dielectric layer and a substantially pure copper layer is deposited over the copper alloy layer. A cross-sectional view of the rounded square lens cut along its diagonal forms a semicircular surface so as to emulate a hemispherical lens in areas close to the diagonal. The two-sided tape is made with a long u-shape which does not interfere with the slots in the outer pieces.