A compression molding which is high in both dimensional accuracy and mechanical strength is difficult to manufacture by a powder molding process. The recorded data may be augmented with additional data or data streams, and the resulting dataset is automatically composited to produce an audience presentation focusing on selected aspects of the full dataset. Furthermore, it is not necessary to secure a capacitance that the silicon film for forming the storage electrode is thicker in advance, which makes the fabrication process simple. A second space is formed between a bottom surface of the socket body and the conductive plate. A method, apparatus, and system for fabricating such instruments are also disclosed.