The present invention is a method and apparatus for encapsulating semiconductor dies and other devices using stencil printing techniques. A high viscosity, high molecular weight silicone based pulling lubricant for THHN cable, or alternatively, erucamide or stearyl erucamide for small THHN gauge wire, is incorporated, by alternate methods, with the nylon material from which the outer sheath is extruded, and is effective to reduce the required pulling force on the cable during installation. The method also includes applying a micro-porous membrane over the at least one reinforcing skin, applying a vacuum film over the micro-porous membrane, introducing a polymeric resin to the core, infusing the resin through the core and through the at least one reinforcing skin by applying a vacuum to the blade assembly, and curing the resin to form the rotor blade. The first and second surfaces each extend from a shear web therebetween to define the generally C-shape in cross section.