A method of manufacturing a silicon wafer with robust gettering sites and a low concentration of surface defects is provided. A bi-directional data connection via the Internet in both directions is enabled even across firewalls and starting from an OPC client, which is not visible as a server on the Internet. The defined section of the transportation track is located between the first position and the second position on the transportation track. The accommodating portion connects to the engaging portion, which includes a concave area that is configured for engaging the male plug. In one example, this allows a \u201cfull bleed\u201d display to be generated. Additionally, the detecting step, the image forming step, and the defect recognizing step are performed even when the electron beam or the focused ion beam is emitted onto the observation area under an irradiation condition different from the certain irradiation condition.