An exhaust gas treatment system is provided, having an internal combustion engine, an exhaust gas conduit, an electrically heated catalyst device, an oxidization catalyst device, an OC temperature sensor, a hydrocarbon adsorber, and a control module. The pads described in this invention are customized to polishing specifications where specifications include to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. A gate valve for conveying the wafer into and out of the processing chamber; and a shower head for spraying processing gas in a shower onto the wafer, are installed inside the processing furnace. Subsequently, the patterned wiring is buried with an SiOF layer as an Si oxide layer containing fluorine, together with the anti-reflection layer and the insulation layer on the upper surface thereby. Defects of the valve stroke adjusting system are detected on the basis of the comparison. The lighting layer is coupled to the ECU and each of at least some of the light elements may be independently turned ON or OFF in response to a first proximity pattern provided by human interaction and received by the proximity sensing system.