A Ta barrier slurry for Chemical-Mechanical Polishing during copper metallization contains an organic additive which suppresses formation of precipitates and copper staining. This structure may be produced continuously or in a batch process. The service switch is configured to controllably interrupt a connection between the utility power service and the load. A near-field exposure apparatus includes the near-field photomask with a positioning unit and a source for illuminating polarized light parallel to the first slit openings for forming a latent-dot-image on an exposure target only where a second slit opening crosses the light shield portion on the near-field photomak.