A chip device including a leadframe that includes source and gate connections, a bumped die including solder bumps on a top side that is attached to the leadframe such that the solder bumps contact the source and gate connections, and a copper clip attached to the backside of the bumped die such that the copper clip contacts drain regions of the bumped die and a lead rail. The three color channels of a Bayer mosaic image are up-interpolated from input space to output space. After the indium gallium arsenide material is formed, the first substrate is substantially thinned or removed by mechanical techniques andor a chemical etch process to extend the spectral range of the infrared detector to wavelengths beyond that of a conventional infrared detector. Each read stack includes a read pull-down transistor having a first threshold voltage, and a read pass gate transistor coupled in series with the read pull down transistor and having a second threshold voltage greater than the first threshold voltage. until a hydrogenation rate of at least 98 mol % is achieved. Data on and between platforms may be encrypted and an audit trail may be generated in compliance with federal standards .