Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board. The components are configured in particular as sections which are assembled into a tubular tunnel thus forming transverse and longitudinal joints. The two portions of the bag are separable by a zipper that goes the entire distance around the bag. Therefore, variations in the electric potential of the capacitor wiring caused by a writing-in electric current of a neighboring pixel can be avoided, whereby obtaining satisfactory display images. Because the capacitive change gives an accurate measure of the size of the tip clearance, a particularly high sensitivity can be achieved in parts where the tip clearance is small, thereby providing a highly precise tip clearance control.