According to at least one example embodiment, a multi-chip system includes multiple chip devices configured to communicate to each other and share hardware resources. The power supply provides current to the SSCD, and includes a resonant controller. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.