The invention relates to a sensor for helium or hydrogen with a vacuum-tight housing, wherein a gas consuming cold cathode array is arranged, in addition to a selectively active passage for the gas to be detected. Also, a flip chip package is made by the method. In one embodiment the memory element is then again written back to its original state. The housing is arranged around the memory, and includes a first section and a tab that is partially attached to the first section to enable data to be written onto the memory through the interface. The processor also generates a second set of subcarrier signals corresponding to the CCI. A bottom portion side extending portion is provided, which extends in a direction of a longitudinal axis K\u2014K from a needle bottom surface inner portion, which is a portion of a bottom surface of the needle on an inner side of the annular seal, into a sack beyond a nozzle chamber.