The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The entire percussion instrument and a portion or all of the pedal device are elastically supported above the floor, on the support member through the first vibration isolating members. The brazing alloy for bonding in air includes Ag and B as essential components. The photonic device is configured to transmit the first set of electromagnetic signals out from the photonic interconnect and transmit the second set of electromagnetic signals into the photonic interconnect.