Methods and systems for centralized kernel module loading are described. After removal of the contaminated surface region, monocrystalline compound semiconductor material is regrown on the remaining seed film to form a layer having a thickness suitable for forming devices therein. In an embodiment, the one or more augers are compression augers. Software drivers developed for interacting with the original hardware device and which are unaware of the high-performance mode will continue to use the \u201clegacy mode\u201d, while enhanced versions of guest software will be able to recognize and utilize the high-performance mode. The monitoring center may operate to assure that employees of the bank facility or others can safely access andor leave the bank facility.