In one embodiment, a semiconductor device includes a single layer substrate having an insulation layer and conductive patterns on a first surface of the insulation layer. A flexible connector may be routed through a latch for an enclosure such as a door or container, and the free ends of the flexible connector may be passed through a first locking member and firmly attached to an insert through the use of one or more attachment members such as set screws. The extending portion forms a first engaging portion to mate with the second engaging portion. The respective timings when the transmitted UWB signals are received with the three antennas depend on the distances between the transmitting antenna and the three receiving antennas. The film also protects the base metal surface in normal atmospheric conditions from exposure to humidity and other atmospheric moisture after removal of the test medium from the propellant tank following completion of testing. The device creates or modifies a memory area.