The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. A telephone terminal is connected via a telephone network to the service processing center. The method includes providing access to the snapshot of data using the created root indirection set, the created root indirection set accessing the deleted pattern. The system further includes a distributed GPU cloud computing platform to perform parallel post-processing of the media content, and an immersive 3D interface. Furthermore, color of the first organic compound and color of the second organic compound are complementary. The method includes automatically cutting in the at least two electric machines as a function of a required drive torque and an expected noise emission associated with the required drive torque, in a case of sole operation of the internal combustion engine, so as to reduce the load of the internal combustion engine.