A blister package for housing a medicament having a base layer and a blister layer, joined together in-part. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet.