A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, includes a supplier for supplying the resist between the substrate and the mold, and a recovery unit for recovering the resist. The bus bar module includes: a plurality of bus bars respectively connecting batteries adjacent to each other of a battery assembly composed of a plurality of batteries overlapped with each other; a main body to which the bus bars are attached, and overlapped with the battery assembly; a plurality of positioning projections and a plurality of locking portions provided on the main body. A plurality of bus elements are spaced apart from one another at a predetermined distance and are in electrical communication with the plurality of light circuits. Peripheral electrodes laterally spaced from the electrode line are formed by pattering the conformal conductive layer.