In order to suppress the warp of a semiconductor package of an over-coat structure, when thermal expansion coefficient, Young’s modulus and thickness of the wiring substrate are s, Es and Hs, respectively, and thermal expansion coefficient, Young’s modulus and thickness of the resin layer are r, Er and Hr, respectively, the value R of is set to be approximately 0. Here, the following expression is satisfied:0. In the preferred embodiment the probe tip is attached to the TEM sample holder pre-form by applying pressure to the pre-form and the probe tip, so as to cause plastic flow of the pre-form material about the probe tip. It is an implant composite material having a constitution which comprises a compact composite of a biodegradable and bioabsorbable polymer containing bioabsorbable and bioactive bioceramic particles and a porous composite of a biodegradable and bioabsorbable polymer containing bioabsorbable and bioactive bioceramic particles, the porous composite being united with the compact composite. A particular human writing system is designated as associated with the string based on the values associated with the individual text characters in the string being within the particular subset of values that corresponds with the particular human writing system. The light sensor generates a sequence of detection signals.