A package includes a chip that has a metal-insulator-metal capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor. In one embodiment, a method of forming an integrated circuit comprises forming an oxide layer on a surface of a substrate, the substrate having a plurality of isolation islands. The metal layers are stacked on top of each other such that the dielectric layers separate the adjacent conductive layers. The flux is then removed and a gas tungsten arc welding operation is performed to deposit a filler on the root weldment and form a second weldment that completely overlays but does not penetrate through the root weldment. The satellite antenna may be positioned according to azimuth and elevation determined from ground measurements of the spot beams and the satellite measurements of the uplink beacon signal.