Embodiments of the present disclosure describe thermal management solutions for multichip package assemblies and methods of fabricating multichip package assemblies utilizing the thermal management solutions. The ORC energy converter with parallel evaporators has the same working fluid for each evaporator and the working fluid is separated after the pre-feed system or the feed system and the flows are mixed after the evaporators or at the condenser inlet. The method further includes analyzing the detected temperature to determine the presence of the exothermic compound which caused the decomposition. Computing an elasticity curve involves having a demand model, values for demand model, and filter sets that restrict the values. A plurality of different games, each defined by game indicia some or all of which are covered by a scratch-off layer are printed, one onto each of the six surfaces except the first and last which carry promotional material.