A method for manufacturing a pixel structure is provided. The audio and video data may be received over a serial bus. Between the sidewalls SW, the liner insulating film 6 formed on each of the side walls of the sidewalls SW are brought in contact with each other to close a space between the sidewalls SW to prevent a void from being generated inside the interlayer insulating film 7 and the liner insulating film 6. A method of leveling a boat lift 12 includes causing substantially vertical movements of first and second portions of the boat lift 12 until the boat lift 12 is horizontally level. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Furthermore a method to reduce leakage power and to increase the performance of a circuit by using said circuit arrangement is described.