The wafer processing installation is disposed in one or more clean rooms. A handover is performed of at least one of a plurality of wireless devices from the first access node to the second access node when a signal level of the second access node received at the at least one of the plurality of wireless devices meets the decreased handover criteria. The oligomer is then polymerized in the subsequent polymerization step to increase the molecular weight. The separation plate also has a projection positioned on the inclined surface that projects a second distance from the inclined surface. In case it is desired that cumulative information about the contact integrity is obtained, is it sufficient to apply a single test signal per electrode. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.