A semiconductor structure is formed in the metal interconnect structure of an integrated circuit in a method that provides either two individual resistors that are vertically isolated from each other, or a metal-insulator-metal capacitor. By adding small-particle inorganic filler 2, it attaches the inorganic filler 2 to inter-fiber 3 and it can obtain an effect to improve strength of friction material substrates 1 by connecting the inter-fiber 3 when an impregnated resin is hardened. When the control aperture is sealed with a thumb or finger and the toy is raised from the water, water in the reservoir is retained in the reservoir.