An alerting system and method for producing tactical views of datalink messages is provided. The semiconductor package includes a discrete semiconductor chip on a die pad, a plurality of bond pads situated next to the chip and formed with a plurality of connecting mechanisms and an encapsulant for encapsulating the chip and the pads. The electrode assembly comprises a tissue treatment electrode and a return electrode electrically insulated one from another by means of an insulation member. The lead may comprise a paddle lead or a multiple level lead, e. The supporting tray defines a first receiving space and a second receiving space for receiving the micro-SIM card and the micro-SD card therein respectively. A first high voltage line is connected to the second decoder and to only the second terminal of the memory cells in the same row in the first sub array.