A method of fabricating BEOL interconnect structures on a semiconductor device having a plurality of via contacts with low via contact resistance is provided. The invention consists of combining, by an involutive function, the flow of data to be transmitted with a spread spectrum sequence ), said sequence being selected according to a configuration message received from a readwrite terminal. At least one of the at least two compounds is selected from a group of anti fungals, antioxidants, and chelators. A spring seat of the leaf spring is received within the axle seat and is tapered. When a user performs an operation for outputting reports on this operation screen A, the remote access apparatus 2 requests output from each image processing apparatus 1.